Thermal RunAway
During operation , temperature of the collector terminal increases ,causing dissipation at the junction (Collector junction), This rise in Ic result increased power dissipation at the junction with consequent rise in temperature at junction .This form a cumulative process and as a rsults Q point shifts or run away . This shifting of Q point due to heating of collector junction is referred to as thermal run away . If this process of thermal run away is not checked or kept within limit ,it may cause permanent damge to IC.
This can be avoided using
a)Proper removal of heat through radiation
b)Proper design and layout of circuit
c)use of forced air drift
d)Use of heat sink providing increased radiation surface
During operation , temperature of the collector terminal increases ,causing dissipation at the junction (Collector junction), This rise in Ic result increased power dissipation at the junction with consequent rise in temperature at junction .This form a cumulative process and as a rsults Q point shifts or run away . This shifting of Q point due to heating of collector junction is referred to as thermal run away . If this process of thermal run away is not checked or kept within limit ,it may cause permanent damge to IC.
This can be avoided using
a)Proper removal of heat through radiation
b)Proper design and layout of circuit
c)use of forced air drift
d)Use of heat sink providing increased radiation surface
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